iPhone X-12 Double-stacked Board Separation & Recombination | REWA Academy Tips

Just Recently, REWA Academy trainees offered responses that the two layers usually stop working to fit very closely in double-stacked motherboard repair work There are even huge gaps, causing pseudo soldering In response, we will share tips as well as notes when separating as well as recombining double-stacked motherboard Peel off foam on the motherboard before home heating Please be noted that we do not advise newbies to warm the motherboard with a hot air gun Since the motherboard may get warmth erratically as well as deform An expert motherboard heating system is what we recommend To help with later removal of the logic board, drive a screw on the reasoning board Puncture the tape with a Sculpture Knife The reasoning board and also middle layer are soldered with low-temperature solder paste So the best temperature for the heating platform will be 155 ° C-165 ° C Push the logic board gently with tweezers when the temperature gets to 165 ° C If the reasoning board is loosened, the tin has actually melted Clamp the screw to eliminate the logic board Eliminate the signal board Eliminate thermal grease with a Sculpture Knife Thermal grease should be removed totally Or else, the thermal grease will touch the logic board to provide increase to pseudo soldering in recombination Affix the signal board to the owner Use a round of Paste Flux Eliminate tin on the bonding pad with Welding torch at 365 ° C and also Solder Wick Tin on the bonding pad must be completely removed The recurring tin will certainly affect the succeeding soldering Clean the bonding pad with PCB Cleanser Clean the logic board with the very same approach Please do not damage components around the bonding pad of the reasoning board while cleaning It is necessary to examine if the bonding pad is cool after cleaning Attach the signal board to the Reballing Platform Placed the reballing pattern in placement to make certain that it is pushing versus the signal board To stop the solder paste from flowing right into the motherboard gap, insert a steel plate Use a layer of low-temperature Solder Paste Rub out excess solder paste with a Lint-free Wipe Eliminate the reballing stencil Inspect if solder paste on the signal board is full While applying solder paste, please make certain that solder paste must have a certain humidity If the solder paste is also completely dry, it will stick to the reballing stencil when the pattern is eliminated As an outcome, the solder paste on the signal board will not be consistent, which can conveniently result in inadequate soldering Put the signal board on the 165 ° C Home heating System to heat Stop home heating after the solder spheres are formed Apply a percentage of Paste Flux after the signal board has cooled Align the logic board with the signal board Keep heating on the 165 ° C Heating Platform When the solder change spills and also logic board sinks, nudge the reasoning board carefully with tweezers to make certain the 2 layers fit closely The push should be gentle and small Tidy the motherboard with PCB Cleaner after the motherboard has actually cooled If you locate the motherboard deformed while recombining, you can place the motherboard on a flat board and secure it with a rubber band Press 2 sides of the motherboard gently To prevent squashing parts, please place a soft paper under the motherboard Following, we will share an additional recombination method The method can be taken if the center bonding pad is not damaged When the tin melts, eliminate the reasoning board in an upright way with tweezers It can be seen that there is a steel pad of 0.05 mm thickness around the signal board at a certain range This steel pad is designed to keep a 0.05 mm space in between the logic board and the center layer, avoiding the solder rounds from connecting while soldering You just need to eliminate thermal grease on the motherboard when the fixing is done Keep original tin on the bonding pad Use a little quantity of Paste Change Finally, line up the reasoning board with the signal board When the temperature gets to 165 ° C and the tin thaws, turn the power off Press two ends of the reasoning board with tweezers up until the motherboard has actually cooled down The logic board and the signal board fit very closely by doing this There will be no linking and solder spheres spillover Visit REWA Academy if you desire to find out more repair skills We have full training course bundles for motherboard diagnosis and repair ability renovation Click the web link in the remark area to buy motherboard repair training course packages Thank you for seeing and also do not hesitate to leave a remark

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